This asynchronous course addresses the basic theory behind Statistical Process Control (SPC), a method used in monitoring and controlling the quality of a process through statistical analysis to ...
How to avoid wafer-based testing during early technology development using a model to determine the optimal Si recess depth target and process window prior to source/drain epitaxy. A new methodology ...
A new methodology to assess the impact of fabrication inherent process variability on 14-nm fin field effect transistor (FinFET) device performance. August 18th, 2021 - By: Coventor A new methodology ...
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